New York, NY — (PRESS RELEASE JET) — 09/27/2017 — The analysts forecast the global CMP equipment market to grow at a CAGR of 6.71% during the period 2017-2021.

CMP is a process technology used in the fabrication of wafers. It is a critical step as the process is used to create a flat, polished surface of the wafer. CMP is a nano-polishing process that integrates a continuous a chemical action along with a mechanical action to make the wafer surface flat and smooth at an atomic level. After planarizing a wafer surface, the subsequent steps of photolithography patterning and material deposition occur with a greater accuracy. This results in the formation of uniform film layers with minimum thickness. The polishing process removes any unwanted conductive or dielectric materials from the wafer surface.

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Covered in this report

The report covers the present scenario and the growth prospects of the global CMP equipment market for 2017-2021. To calculate the market size, the report considers the sales of CMP equipment for polishing 150mm, 200mm, and 300mm wafers. The report does not consider 100mm wafers.

The market is divided into the following segments based on geography:
– Americas
– APAC
– EMEA

The report, Global CMP Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
– Applied Materials
– EBARA
– Lapmaster
– LOGITECH

Other prominent vendors
– Entrepix
– Revasum
– TOKYO SEIMITSU

Market driver
– Rising number of fabs
– For a full, detailed list, view our report

Market challenge
– High development costs
– For a full, detailed list, view our report

Market trend
– Use of NEMS
– For a full, detailed list, view our report

Key questions answered in this report
– What will the market size be in 2021 and what will the growth rate be?
– What are the key market trends?
– What is driving this market?
– What are the challenges to market growth?
– Who are the key vendors in this market space?

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Table Of Contents – Major Key Points

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
– Market outline

PART 05: Market landscape
– Market overview
– Market size and forecast
– Five forces analysis

PART 06: Market segmentation by wafer size
– Market overview
– Global CMP equipment market by 300mm wafers
– Global CMP equipment market by 200mm wafers
– Global CMP equipment market by 150mm wafers

PART 07: Market segmentation by end-user
– Market overview
– Global CMP equipment market pureplay foundries
– Global CMP equipment market by IDMs

PART 08: Geographical segmentation
– Market overview
– CMP equipment market in APAC
– CMP equipment market in Americas
– CMP equipment market in EMEA

PART 09: Key leading countries
– Taiwan
– China

PART 10: Decision framework

PART 11: Drivers and challenges
– Market drivers
– Market challenges

PART 12: Market trends
– Use of NEMS
– Growth of ULSI
– Transition from planar to 3D structures
– Increasing size of wafers

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